LTE 4G/5G Test SIM Card for CMW500 Anritsu MT8820C Factory Test Nano USIM Card 10Packs

Agilent 8960 /CMU200 /CMW500 / Anritsu MT8820C Test SIM Card Product Description Card Name：Agilent 8960 /CMU200 /CMW500 / Anritsu MT8820C Test SIM Card Material：PVC Temperature resistance： 0℃~60℃ Support Network：2G-GSM 3G-WCDMA 4G-LTE Support Test Machine：CMU200, CMW500,Agilent 8960,Anritsu MT8820C Test Items：ireless & IoT Testing Testing Workplace：Mobile Phone Factory, Labs Specifaction: 1. GlobalPlatform Card Specification v2.2: Card Specification from GlabalPlatform. 2. ETSI TS 102 225(Relaese6): "Smart Cards; Secured packet structure for UICC based applications, European Telecommunications standards Institute Project Smart Card Platform (EP SCP), 2004". 3. ETSI TS 102 226(Relaese6): "Smart cards; Remote APDU structure for UICC based applications, European Telecommunications standards Institute Project Smart Card Platform (EP SCP), 2004". 4. ISO/IEC 14443-3: "Identification cards – Contactless integrated circuit(s) cards – Proximity cards – Part 3: Initialization and anti-conllision". 5. ISO/IEC 14443-4: "Identification cards – Contactless integrated circuit(s) cards – Proximity cards – Part 4: Transmission protocol". 6. ETSI TS 102 622: "Smat Cards; UICC – Contactless Front-end (CLF) Interface; Host Controller Interface (HCI)(Release 7)". 7. ISO/IEC 7816-6: "Identification cards – Interindustry data elements for interchange". 8. ISO/IEC 8825-1: "Information technology – ASN.1 encoding rules: Specification of Basic Encoding Rules (BER), Canonical Encoding Rules (CER) and Distinguished Encoding Rules (DER)". 9. ISO/IEC 8859-1: "Information technology – 8-bit single-byte coded graphic character sets – Part 1: Latin alphabet No.1". 10. IETF RFC 3629: "UTF-8, a transformation format of ISO 10646". 11. ISO/IEC 18092: "Information technology – Telecommunications and information exchange between systems – Near Field Communication– Interface and Protocol (NFCIP-1)". 12. ETSI TS 102 223: "Smart cards; Card Application Toolkit (CAT)(Release 6)". 13. Java CardTM 3.0 Runtime Environment, Classic Edition: "Runtime Environment Specification – Java CardTM 3.0, Classic Edition". 14. ISO/IEC 10918-1: "Information technology – Digital compression and coding of continuous-tone still images: Requirements and guidelines". 15. ETSI TS 102 221: "Smart cards; UICC-Terminal Interface; Physical and Logical Characteristics". 16. ETSI TS 102 223: "Smart cards; Card Application Toolkit (CAT)(Release 6)". 17. ETSI TS 102 224: "Smart Cards; Security mechanisms for UICC based Applications – Functional requirements". 18. ETSI TS 123 048: "Digital cellular telecommunications system (Phase 2+); Universal Mobile Telecommunications System (UMTS);Security mechanisms for the (U)SIM/USIM application toolkit; Stage 2 (3GPP TS 23.048 Release 5)". 19. ETSI TS 102 127: "Smart Cards; Transport protocol for CAT applications; Stage 2". 20. Java CardTM Specification Version: 2.2.1 21. Sun Microsystems Java Card? Specification: "Java Card? 2.2.1 Application Programming Interface". 22. Sun Microsystems Java Card? Specification: "Java Card? 2.2.1 Virtual Machine Specification". 23. ETSI TS 102 241: "Smart Cards; UICC Application Programming Interface (UICC API) for Java Card (TM); (Release 6)". 24. 3GPP TS 31 130 Release 6: "(U)SIM API for Java Card?" 25. ETSI TS 102 268: "Test specification for UICC Application Programming Interface for Java Card (TM); (Release 6)". 26. ETSI TS 131 213 (3GPP TS 31.213 version 6.1.0 Release 6): "Test specification for subscriber (U)SIM; Application Programming Interface (API) for Java Card?". 27. ETSI TS 143 019 : Technical Specification Digital cellular telecommunications system (Phase 2+);Subscriber Identity Module Application Programming Interface (SIM API) for Java Card; Stage2(3GPP TS 43.019 version 6.0.0 Release 6)

• Support Test Machine：CMU200, CMW500,Agilent 8960,Anritsu MT8820C
• Support Network：2G-GSM 3G-WCDMA 4G-LTE 5G-LTE
• 2FF/3FF/4FF Mini/Micro/Nano 3 size in one, support all the mobile phone
• Test Items：wireless & IoT Testing,Testing Workplace：Mobile Phone Factory, Labs<BR>
• Temperature resistance： 0℃~60℃